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Solder Joint Reliability: Theory and Applications 1991 edition
John H. Lau
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A$ 396,54
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Arvioitu toimitus pe 21. marras - ti 2. joulu
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Solder Joint Reliability: Theory and Applications 1991 edition
John H. Lau
New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them.
631 pages, 146 black & white illustrations, biography
| Media | Kirjat Hardcover Book (Sidottu kirja kovilla kansilla sekä suojakannella) |
| Julkaisupäivämäärä | perjantai 31. toukokuuta 1991 |
| ISBN13 | 9780442002602 |
| Tuottaja | Van Nostrand Reinhold Inc.,U.S. |
| Sivujen määrä | 631 |
| Mitta | 155 × 235 × 34 mm · 975 g |
| Kieli | English |
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